India opens next phase of semiconductor programme with Semicon 2.0 portal; ECMS approves 12 more projects
The new portal invites applications for three strategic pillars of Semicon 2.0, while fresh electronics component approvals take cumulative ECMS investments to ₹77,051 crore across 16 states.
Union Minister for Electronics and Information Technology, Railways and Information & Broadcasting, Ashwini Vaishnaw, launches the Semicon 2.0 portal in New Delhi on Friday.
NEW DELHI: India has opened the next phase of its semiconductor manufacturing programme with the launch of the Semicon 2.0 web application portal, while approving 12 additional projects under the Electronics Components Manufacturing Scheme (ECMS), involving a projected investment of ₹7,503 crore.
Union Minister for Electronics and Information Technology Ashwini Vaishnaw launched the portal for Pillars 2, 3 and 4 of the Semicon India Programme, inviting applications for projects covering semiconductor manufacturing equipment and materials, new fabrication facilities, and assembly, testing, marking and packaging (ATMP) and outsourced semiconductor assembly and test (OSAT) capabilities.
The launch marks the next stage of India’s efforts to build a comprehensive semiconductor ecosystem, extending beyond chip design and fabrication to include equipment, materials, research, advanced packaging and talent development.
The Union Cabinet has approved Semicon 2.0 with a fiscal outlay of ₹1,27,500 crore under the India Semiconductor Mission (ISM).
Six strategic pillars of Semicon 2.0
The programme is structured around six strategic pillars:
- Chip design: Strengthening India’s semiconductor design capabilities.
- Machines and materials: Developing domestic capabilities in semiconductor equipment and materials.
- More fabrication facilities: Encouraging the establishment of additional semiconductor fabrication plants.
- ATMP/OSAT: Expanding assembly, testing, marking and packaging capabilities.
- Research and development: Supporting semiconductor research and technological innovation.
- Talent development: Building skilled human resources for the semiconductor industry.
Applications are now open for Pillars 2, 3 and 4 through the newly launched web portal.
Addressing the gathering, Vaishnaw said India’s electronics manufacturing sector was moving beyond assembly towards developing a comprehensive domestic value chain covering modules, components, materials and advanced technologies.
He highlighted emerging domestic capabilities in battery cells, copper foils, copper-clad laminates and high-end printed circuit boards. Government initiatives, he said, were strengthening domestic supply chains and creating opportunities for micro, small and medium enterprises (MSMEs), with nearly 50% of the units approved under ECMS belonging to the MSME sector.
Under Semicon 2.0, the government intends to attract at least three major equipment manufacturers and five companies in chemicals and gases to India. The Minister emphasised that project selection would focus on quality, technological depth, research and development, and global competitiveness.
ECMS approves 12 additional projects worth ₹7,503 crore
Alongside the Semicon 2.0 portal launch, the Ministry of Electronics and Information Technology (MeitY) announced 12 additional approvals under ECMS, taking the cumulative number of approved applications to 118.
The latest approvals involve projected investments of ₹7,503 crore, expected production of ₹39,045 crore and the creation of 7,127 direct employment opportunities.
The approvals cover 10 target-segment products across components, supply-chain products and capital goods. They extend domestic manufacturing capabilities in printed circuit boards, battery materials, electronic components and factory automation.
The component approvals include:
- Multi-layer printed circuit boards: NeST ICELR Private Limited.
- Relays: TDConnex (Chennai) Private Limited.
- Heat sinks: Modern Automotives Limited.
- Specialty ceramics: Voltix Semicon Private Limited.
In the supply-chain category, approvals have been granted for:
- Copper foil: Indo Asia Copper Limited.
- Anode material for lithium-ion cells: TACC Limited.
- Cathode active material: Vidyuta Materials Private Limited.
- Polypropylene film for capacitor-grade dielectric applications: Enerfolie LLP.
- Camera rim: Surface Modification Technologies Pvt. Ltd.
The scheme also supports domestic manufacturing of capital goods and their components. Approvals in this category include precision moulds and tooling by TDConnex (Chennai) Private Limited, power and control systems for capital equipment by Rockwell Automation India Private Limited, and factory automation and system integration equipment by Wipro Pari Robotics Private Limited.
The latest projects are spread across seven states: Gujarat, Karnataka, Madhya Pradesh, Maharashtra, Punjab, Tamil Nadu and Uttar Pradesh.
The approvals also mark the first ECMS-supported projects in copper foil, cathode active material and specialty ceramics, expanding the range of upstream materials being manufactured domestically.
Cumulative ECMS investment reaches ₹77,051 crore
The latest approvals build on 106 applications involving investments of ₹69,548 crore announced earlier under ECMS.
With the addition of 12 projects, the scheme’s cumulative position now stands at:
| Indicator | Cumulative approvals |
|---|---|
| Approved applications | 118 |
| Products covered | 34 |
| States covered | 16 |
| Expected investment | ₹77,051 crore |
| Projected production | ₹5,73,146 crore |
| Expected direct employment | 81,755 |
The approvals are expected to strengthen domestic supply chains, increase value addition, reduce import dependence and expand India’s capabilities in advanced electronics manufacturing.
Building a semiconductor and electronics manufacturing ecosystem
The first phase of the Semicon India Programme has already resulted in the approval of 12 semiconductor projects across six states, involving cumulative investments of more than ₹1.64 lakh crore. Five of these projects had commenced commercial production as of October 2026.
The India Semiconductor Mission has also supported the development of the design and talent ecosystem. According to the Ministry, 105 startups have received access to electronic design automation (EDA) tools, 24 startups have been supported through funding, and 15 have secured venture capital funding.
Under the Chips to Startup programme, 332 institutions have been provided with EDA tools, with approximately 70,000 students trained so far.
The government is positioning Semicon 2.0 as the next stage in developing domestic capabilities across the semiconductor value chain, while ECMS is expanding the manufacturing base for components and materials required by the electronics industry.
The simultaneous launch of the new application portal and announcement of additional ECMS approvals reflects the government’s focus on strengthening manufacturing capacity, encouraging private investment and establishing India as a globally competitive semiconductor and electronics manufacturing hub.
