Cabinet Clears ₹4600-Crore Semiconductor Units in Odisha, Punjab and Andhra Pradesh
Officials said the projects will complement India’s expanding chip design ecosystem, which is being supported through government-backed design infrastructure in 278 academic institutions and 72 start-ups, along with a talent development programme that has already benefited over 60,000 students.
New Delhi, August 13: The Union Cabinet, chaired by Prime Minister Narendra Modi, on Tuesday approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM) with a total investment of around ₹4,600 crore. The projects — proposed by SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies — are expected to generate 2,034 skilled jobs and catalyse the electronics manufacturing ecosystem across the country.
With this decision, the number of approved projects under ISM has reached 10, representing cumulative investments of approximately ₹1.6 lakh crore in six states. The move comes amid rising demand for semiconductors in sectors such as telecom, automotive, data centres, consumer electronics, and industrial electronics, and is aimed at advancing India’s goal of becoming self-reliant in chip manufacturing.
Two of the newly approved units — SiCSem and 3D Glass Solutions Inc. — will be set up in Info Valley, Bhubaneswar, Odisha. SiCSem, in collaboration with Clas-SiC Wafer Fab Ltd., UK, will establish India’s first commercial compound semiconductor fabrication facility, producing silicon carbide devices for applications in defence, electric vehicles, railways, solar inverters, and high-performance electronics. 3D Glass Solutions will build an advanced packaging and embedded glass substrate unit, bringing cutting-edge glass interposer and 3D Heterogeneous Integration (3DHI) technology to India, with applications in AI, photonics, automotive, and defence systems.
ASIP Technologies, in partnership with South Korea’s APACT Co Ltd, will set up a manufacturing unit in Andhra Pradesh to produce 96 million units annually for use in mobile phones, set-top boxes, and automotive electronics. In Punjab, CDIL will expand its Mohali facility to produce high-power discrete semiconductor devices, including MOSFETs, IGBTs, Schottky diodes, and transistors, catering to EVs, renewable energy systems, industrial applications, and communication infrastructure.
Officials said the projects will complement India’s expanding chip design ecosystem, which is being supported through government-backed design infrastructure in 278 academic institutions and 72 start-ups, along with a talent development programme that has already benefited over 60,000 students.
